IEEE P1386.1 DRAFT 2.2 PCI PDF
Introduction. (This introduction is not part of IEEE Std P, DraftStandard for a Common Mezza- The mezzanine card’s local bus can be PCI, SBus orother local buses as they are developed in the . Relationship Between VME, VME64 and VMEbus. .. Other Host PCB Mechanics. Compatibility – IEEE P PMC module which complies to PCI Local Bus Specification Revision Provides one multifunction interrupt. 5V signaling. Created for compact PCI Mezzanine Card site rack-based system designs, the read-writer’s form factor (PMC) conforms to the PMC IEEE P/Draft
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This draft standard defines the mechanics of a common mezzanine card family. Single wide mezzanine cards are 75 mm wide by mm deep by 8. Permission is also granted for member bodies and technical committees of ISO and IEC to reproduce this document for purposes of developing a national position.
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A P P E N D I X D – Bibliography
Any figure that was changed will have a charge bar on the right side of the figure title. Only one change was made to draft 2. The last sentence in paragraph 6. The major goal of this draft standard is to provide the mechanics of a mezzanine card family that can be deployed on a variety of different host computer platforms. The mezzanine card’s local bus can be PCI, SBus or other local buses as they are developed in the future. The second goal of this draft standard is to iree have one mezzanine card mechanical definition for a specific type of local bus rather than having multiple mechanical implementations as has happened in the past.
Multiple mechanical implementations fragments the market and destroys economy of scale for manufacturing, engineering, sales and marketing. A single mechanical definition builds larger markets with many more unique functions being provided for the multitude of user applications, and at a lower price. Both iee suppliers and users win by enjoying the benefits of a larger unified market.
In when the effort to develop a mezzanine card standard was started, there seemed to be a market need to shrink the SBus IEEE mechanical form factor such that it would fit in a single VME board slot. SBus cards are As a result, only two CMC form factors are defined, single width and double width. After the first sponsor ballot April, a new bus architecture was introduced to the market that rapidly gained large market interest.
Definitions, Abbreviations and Terminology Electrical and Logical Layers Host Component Height Limits Host Side 1 Maximum Heat Dissipation CMC Presents to System This draft standard defines p3186.1 mezzanine card mechanics for these types of applications. This mechanical definition is based on IEEE Figure illustrates a single size and a double size mezzanine card defined by this draft standard.
Multibus I boards don’t use front panels. The size and shape of desktop computers, portable computers, servers and other similar types of computers varies considerably, depending on specific target markets and associated needs. Figure illustrates how a CMC could be mounted inside a desktop or portable computer host. The host may place low height components under the mezzanine card for additional functionality.
The host is to provide one or more slot opening s into which the mezzanine card s are plugged. The host slot opening provides mechanical support as well as EMI shielding. Ueee maximum utilization of component space, the mezzanine card iede typically placed such that the major component side side one of the mezzanine card faces the major component side side one of the host computer’s main board.
The local bus interface to the host computer is provided via one or more connectors between the mezzanine card and the host board.
PCI Bus, PC CardBus, PCMCIA, Reader Writer, Mezzanine PMC
These connectors reside on the rear of the mezzanine card. At the time this standard was developed and approved, one child standard was developed and approved p136.1 the same time.
This is the P In the future, additional child standards can be developed that use the basic mechanical definition from this standard but have different local buses. Note that the P Drawings are not to scale. First angle projection has been used throughout this draft standard. This defines the actual dimensions of a 25 mm metric equipment practice. These actual dimensions are derived from coordination dimensions using the principle of boundary and axis references illustrated in IEEE Std  and IEC .
These mounting pitches have been used to derive the key dimensions given in this Copyright c IEEE. They are also ieew when extending this standard with additional dimensions where such extensions are permitted and when alternative positions of piece parts are described.
In such cases, it is obvious that iees relationships between involved dimensions shall be maintained. References The following publications are used in conjunction with this standard: Limits and Methods of Measurement, www.
There is less mechanical flex strength in the flat front panels versus U shaped front panels. The preference should be to use the U shaped front panels, in all Eurocard type applications.
Definitions, Abbreviations and Terminology 3. Designers shall implement specific mandatory requirements to ensure interchangeably and to claim conformance with the standard. This key word is used interchangeably with the phrase “is required”. This key word is used interchangeably with the phrase “is recommended.
This p13886.1 word is used interchangeably with the phrase “is optional”. A reference dimension used to coordinate mechanical interfaces. This is not a manufacturing dimension with a tolerance. An add-on printed circuit board PCB which is mounted parallel to a host computer board.
A theoretical plane, not having thickness or tolerance, used to separate space. Defined as some point on a card’s PCB, that is used by the assembly equipment for the reference positioning of a set of components. Mezzanine Card Mechanics This chapter defines the mechanical dimensions for mezzanine cards. The host mezzanine card slot mechanics are defined in the next chapter. These daft sizes are listed in Table The designation of each card size is given in rdaft first column.
The width increment of CMCs is 75 mm. The depth of CMCs is mm. Should other mezzanine cards be used in conjunction with one or more CMCs, there will be a 1 mm gap between the edges of two single CMCs.
Simple PMC to S-LINK Interface User’s Guide
If the reader needs more understanding of this grid structure and wants to know how it ties into the international metric measurement systems, the reader should obtain a copy of IEEE The envelope for a single CMC is shown in Figure The component envelope maximum height shall be 8. The component envelope is where electronic components such ICs, chips, devices, resistors, capacitors, etc. No component is allowed to protrude through this envelope, except the CMC connectors, standoffs and bezel retention screws.
PCB warpage during the manufacturing process shall be included for calculating and measuring maximum component heights so as not to protrude through this envelope. Larger components may also be placed in this envelope. A connector or component of any kind shall not protrude outside this specified envelope. No limit is defined for the length of this protrusion. The rest of the mechanics are found on the single or double CMC dimensions.
Note that the standoff hole size is not defined. The size of these holes depends on how the standoffs are permanently attached to the CMC during assembly. For these types of applications, voltage keying holes are provided on the mezzanine cards. The two voltage are 5V and 3. If the mezzanine card’s local bus operates on the 5V signaling level, it shall provide a 5V keying hole.